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| Principal Uses |
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Uses in the compound semiconductor, the high pure alloy and the semiconducting material as doping agent, the contact material and so on. |
| Physical Properties |
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| Click to Enlarge |
| Chemical Formula |
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In |
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Purity
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>=99.99%
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Melting Point
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156.61°C
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Boiling Point
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2072°C
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| Size |
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The size may be made according to customer's request, such as
Foil: 0.1 x 100 x 100mm, 0.2 x 100 x 100mm or 0.1 x 150 x 250mm
Wire: Dia1～5mm
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| Characterisation Methods |
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Purity
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Tested by ICP—AES means |
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