Principal Uses
	Uses in the compound semiconductor, the high pure alloy and the semiconducting material as doping agent, the contact material and so on.

Physical Properties
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	Chemical Formula	：	In
	Purity	：	>=99.99%
	Melting Point	：	156.61°C
	Boiling Point	：	2072°C
	Size	：	The size may be made according to customer's request, such as Powder:  -100～900mesh & 1～5µm  Ball: Dia1.0～5.0mm

Characterisation Methods
	Purity	：	Tested by ICP—AES means